IOP Science: To fabricate a low cost, highly conductive ink for inkjet printing, we synthesized a gram scale of uniformly sized Sn nanoparticles by using a modified polyol process and observed a significant size-dependent melting temperature depression from 234.1 'C for bulk Sn to 177.3 'C for 11.3 nm Sn nanoparticles.
A 20 wt% of Sn nanoparticles was dispersed in the 50% ethylene glycol: 50% isopropyl alcohol mixed solvent for the appropriate viscosity (11.6 cP) and surface tension (32 dyn cm − 1). To improve the electrical property, we applied the surface treatments of hydrogen reduction and plasma ashing.
The two treatments had the effect of diminishing the sheet resistance from 1kΩ/sq to 50Ω/sq. In addition, conductive patterns (1cm x 1cm) were successfully drawn on the Si wafer using an inkjet printing instrument with conductive Sn ink. The maximum resistivity for an hour of sintering at 250 'C was 64.24Ωcm, which is six times higher than the bulk Sn resistivity (10.1Ωcm).