: "Purpose – The purpose of this paper is to evaluate the influence of microvia design on solder joint reliability and to present a printed circuit board (PCB) microvia design approach capable of reducing or eliminating voiding in solder joints.
Design/methodology/approach – Five different types of via-in-pad designs were incorporated into a test vehicle and their performance evaluated using a variety of standard reliability tests."
Design/methodology/approach – Five different types of via-in-pad designs were incorporated into a test vehicle and their performance evaluated using a variety of standard reliability tests."
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